Description
Product Material: Gel
Special Properties: Dielectric, Low Viscosity, Sealing Characteristics, Thermal Conductivity
Dielectric Strength: >20kV/mm
Package Type: Kit
Package Size: 1000 g
Volume Resistivity: > 2 . 10¹⁵Ω cm
This is Dielectric Low Viscosity Sealing Characteristics Thermal Conductivity Gel Potting Compound manufactured by Raytech. The manufacturer part number is M agic-Gel. It has a/an gel as product material . It has a/an dielectric, low viscosity, sealing characteristics, thermal conductivity special properties . In addition, the product has >20kv/mm dielectric strength . The package is a sort of kit. Its package size is approximately 1000 g . With > 2 . 10¹⁵ω cm volume resistivity .
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